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Pan Ting-rui, a professor of biomedical engineering at the school, said: “When the glue is peeled off, materials like semiconductor flakes will break off, and the traditional glue forms a thick layer between the two surfaces, and the new nanometer The glue can be heat-transferred and printed, or it can be applied to a model, forming layers that are only a few molecules thick.â€
This nanogel is based on a transparent material called polydimethylsiloxane (PDMS). When it peels off on a smooth surface, it leaves a thin layer of sticky residue, which is often considered by researchers as an annoying thing. Dr. Pan and his colleagues realized that this kind of residue can be used as a substitute for glue, and its surface will be strengthened by oxidation.
Professor Pan said that this kind of nano-gel can be used to glue silicon wafers together to make a new (coatingol) multi-layer computer chip; it can also be applied to households, such as making double-sided adhesive tapes or sticking objects. On the tiles. At present, this glue is only suitable for smooth surfaces and can be removed by heat treatment.
It is reported that engineers at the University of California, Davis recently invented an ultra-thin, highly viscous nanogel that can be used to process next-generation microchips. The study has been published in the recently published "Advanced Materials Magazine."