Windows are desiged for use in optical systems to separate two enviroments while passing a particular spectral range between them.Applications include laser set-ups (e.g.at Brewster's angle),emitter,detector protection devices, such as in sepctrophotometers and imaging systems.
China Star Optics offers all types of windows made from different materials. Such as N-BK7, Fused silica, sapphire,CaF2, Silicon, Borofloat, high borosilicate glass and other optical glass supplied by Schott and Chinese CDGM are available upon request. Windows at shape of round,quadrate, triangular or other polygonal are also available upon request.In addition, we provide a variety of single layer or multiplayer anti-reflecting coating,HR,PR coatings on Optical Windows.
Specification of our optical windows as follow: Infrared Window,Zinc Selenide Windows,Znse Wedged Window,Zinc Selenide Laser Window China Star Optics Technology Co.,Ltd. , https://www.realpoooptics.com
The processing of hard silicone resin usually uses a metal bond diamond grinding wheel, and the ordinary metal bond contains a metal component which adversely affects the silicone resin and needs to be removed.
In order to reduce the amount of chips and processing damage, Japan's TDT Mfg uses a unique diamond abrasive particle control technology to prepare a metal bond double bevel wheel and a notch grinding wheel for semiconductor wafers; the bonding agent has high wear resistance and can maintain good The wheel size and tool life is longer. The number of new and re-grinding wheels required to process a unit number of wafers is greatly reduced, thereby saving processing costs. In addition, TDT Mfg has adopted a new manufacturing process to develop an alloy component to replace the common metal bond, thereby reducing the adverse effects on silicon wafers.
Metal bond double beveled grinding wheel: 
Notch grinding wheel: 
Beveled surface roughness: 
Processing parameters: 
*Material:high borosilicate glass, BK7,UV-grade fused silica (JGS1) or other optical crystals materials
*Length tolerance:+/-0.01
*Width tolerance:+/-0.01
*Center thickness tolerance:0.005mm
*Surface quality:80-50 to 10-5 Scratch/Dig
*Surface flatness:<lambda to lambda/20
*Parallelism<=1min -- 2sec
*Clear Apenture:80% -- 100%
Abstract The roughness of the beveled surface: sp; the beveled edge process is an important process in the pre-processing of silicon wafers, which affects the overall product output, post-processing time and product cost. The hard and brittle silicon material is easy to produce a large amount of chips during the beveling process, thus reducing the production...
The beveled edge process is an important process in the silicon wafer pre-processing process, affecting the overall product yield, post-processing time and product cost. Hard and brittle silicon materials are prone to large amounts of chips during the beveling process, which reduces the quality of the product. In addition, in the processing of hard materials, the bonding agent wears faster, and it is difficult to ensure the shape accuracy of the workpiece. Tool life is further reduced, and frequent tool trimming increases processing costs.